Mechanical Thermal Dewatering of Wheat Straw in Production of Chip Board
Amid the applications of wood alternatives, chipboard is one option because hardwood in Pakistan is gradually becoming economically unsuitable. The scope of this work has been designed to substitute chipboard raw material, wood by wheat straw. Theme of experimental work is based on use of different wheat straw pretreatments. The suitability of wheat straw for chipboard has been assessed through evaluation of its mechanical and water resistance properties and comparison with standard chipboard properties. The results depicts that board prepared from wheat straw has low density then the conventional chipboard. Low density refers to the fact that wood itself is denser as compared to wheat straw. Moreover, wheat straw board has low mechanical strength and high water resistance compared with conventional board .The low mechanical strength has been found to be due to adhesive repellent waxy layer on wheat straw and low temperature pressure conditions of thermal compression rig being used for pelletizing. It has been found that mechanical and water resistance strength of wheat straw boards can be improved by the acid treatment of wheat straw. It effectively removes the waxy layer and enhances its acidity, hence improving bonding with adhesive and results in higher density and strength.